Item # D-288-10-05, High Power Density Modules (HPDM)
High performance modules for applications where the device (lasers, chip tests devices, etc.) generates
a lot of heat that must be dissipated either intermittently or continuously.
Recommended operating temperature: up to 120° C
Recommended operation current: 0.5 - 0.7 of Imax
Very high COP (coefficient of performance) can be attained when the HPDM is operated at approximately 0.5 of Imax
Cycling stability in ON-OFF power mode: over 40,000 cycles (cycle time is 60 seconds or more)
Cycling stability in 20/80 power mode: up to 10,000 cycles
L1 - Thickness Tolerance ± 0.01 mm L2 - Thickness Tolerance ± 0.02 mm
Optional Sealing Type2
No Sealing S - Silicon Sealing E - Epoxy Sealing
1 L2 is the standard thickness tolerance, L1 is offered at an extra cost. 2 Max Δ T is reduced by 2-3ºC for silicone and by 1-2ºC for epoxy sealing versions.
Series
"D" – SERIES, HIGH POWER DENSITY MODULES ("HPDM") High performance modules for the applications where device (lasers, chip tests devices, etc.) generates a lot of heat that need to be dissipated continuously or for a short time
Recommended operating temperature: up to 120ºС
Recommended operation current: 0.5-0.7 of Imax
Cycling stability in ON-OFF power mode: over 40.000 cycles (cycle time is 60 seconds or more)
Cycling stability in 20/80 power mode: up to 10.000 cycles