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All Categories > Thermoelectric Modules (TEM) > High Power Density Modules (HPDM) > Item # D-200-14-06  


Item # D-200-14-06, High Power Density Modules (HPDM)

High performance modules for applications where the device (lasers, chip tests devices, etc.) generates a lot of heat that must be dissipated either intermittently or continuously.

  • Recommended operating temperature: up to 120° C
  • Recommended operation current: 0.5 - 0.7 of Imax
  • Very high COP (coefficient of performance) can be attained when the HPDM is operated at approximately 0.5 of Imax
  • Cycling stability in ON-OFF power mode: over 40,000 cycles (cycle time is 60 seconds or more)
  • Cycling stability in 20/80 power mode: up to 10,000 cycles

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    Specifications  · Options  · Series

    Specifications

    Imax1
    		14.9 A

    Umax
    		25.5 V

    Qmax
    		236.8 W

    ΔTmax
    		68 ºC

    AC Res. @25 ºC
    		1.29 Ohm

    Dimension A1
    		40 mm

    Dimension A

     View
    		44 mm

    Dimension B

     View
    		40 mm

    Dimension H

     View
    		3.3 mm
    1 All values @ T= 25º C


    Options

    Thickness Tolerance Index1
    		L1 - Thickness Tolerance ± 0.01 mm
    L2 - Thickness Tolerance ± 0.02 mm

    Optional Sealing Type2
    		No Sealing
    S - Silicon Sealing
    E - Epoxy Sealing
    1 L2 is the standard thickness tolerance, L1 is offered at an extra cost.
    2 Max Δ T is reduced by 2-3ºC for silicone and by 1-2ºC for epoxy sealing versions.


    Series
    "D" – SERIES, HIGH POWER DENSITY MODULES ("HPDM")
    High performance modules for the applications where device (lasers, chip tests devices, etc.) generates a lot of heat that need to be dissipated continuously or for a short time
    • Recommended operating temperature: up to 120ºС
    • Recommended operation current: 0.5-0.7 of Imax
    • Cycling stability in ON-OFF power mode: over 40.000 cycles (cycle time is 60 seconds or more)
    • Cycling stability in 20/80 power mode: up to 10.000 cycles



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