Thermal Grease design with thin bond lines and excellent wetting properties are excellent for thermoelectric and other thermal applications. Silicone and nonsilicone formulations are available with thermal conductivity up to 4.5 W/mk.
Manufactured and quality tested under ISO 9001:2000 / TS 16949:2002 standards by EMS in the USA and China.
Typical Applications:
- Thermal Assemblies/Thermoelectrics
- Thermal interface between semiconductors case and heat sink
- Computer CPU
