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Item # 250014-001, Air-to-Plate Thermoelectric Assemblies
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ATP is typically used in three key applications for cooling/heating:
1.) Objects directly on the cold plate, or objects on an additional cold plate of your own design
2.) Enclosures by attaching a thermal conductive container to the cold plate
3.) Liquids by attaching a thermal conductive tank or liquid heat sink to the cold plate
The heat is absorbed by the cold plate, pumped through the TE modules and then dissipated to the air by an air heat sink. Our coolers deliver compact and reliable cooling in a range from 42 to 80 watts. All models are optimized for a variety of voltages, ΔT and efficiency. Typical applications include cooling electronics, analytical instruments, lasers and commercial refrigeration.
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