Item # TEE-12-14-3-950-6M, Standard Thermoelectric Elements and Materials
Since 1998 Crystal Ltd. has been producing thermoelectric elements of different cross-section and height. A unique technology allows growing the plates of thermoelectric material with defined width that forms one of the sizes of thermoelectric element (dice, pellet). It requires further only two cutting operations to form element’s length and height. In result the elements have exact geometric dimensions.
An improved method of electro-erosive cutting technology is used to cut plates of thermoelectric material into elements with high accuracy of geometric dimensions and high quality of the surface after cutting.
Taking into consideration the above-mentioned features of thermoelectric elements, the several Ni-based coatings have been developed to use the elements for assembling the modules used in various applications. Crystal Ltd’s own mass-production factory manufactures a wide range of thermoelectric modules in practically any necessary volumes.
All elements have the barrier antidiffusion coating fully compatible with RoHS requirements and modules assembling processes using lead-free solders.
Crystal Ltd. offers at the market a wide range of thermoelectric elements (based on Bi2Te3 solid solutions) and modules both for cooling and power generation. An original patented technology of thermoelectric material crystallization from a liquid melt in a flat cavity provides thermoelectric elements (TE) with a crystalline structure oriented strictly along direction of current providing a unique combination of thermoelectric and mechanical properties. The special methods of barrier multilayered Nickel and Molybdenum coatings deposition in vacuum also provide outstanding lifetime and thermal stability of elements and modules.
The elements can be made accordingly to customer’s special requirements:
• Other dimensions available within ranges:
- Width, Length – from 0.35 mm to 5.00 mm
- Height – from 0.30 mm 3.00 mm
• Average electric conductivity value (for one batch) within range 850 - 1150 Ohm-1cm-1
• Elements with heightened Figure of Merit (Z) = 3.05
• Electric conductivity tolerance in one batch of elements can be ± 3 %
• 100 % appearance inspection
• Tolerance of every dimension ± 0.01 mm
• Elements of rectangular cross-section with A size not equal to B size
• Elements with crystalline structure oriented parallel to chosen couple of edges (A x H) or (B x H)
• Elements with variable width
• Special design elements
Please Request Information and we will help you meet your needs.
1 Figure of Merit measured in chains of 6 couples of n+p elements
connected in series, measured by Harman’s Method, x103 K-1, in
vacuum (control samples with dimensions A, B = 1.40 mm,
H = 1.60 mm)
Options
Electric Conductivity (Ohm-1cm-1)1
850 900 950 (Standard) 1000 1050
Coating Types2
Type “6M” (Standard) -
The elements with this coating are used to assemble the modules for traditional cooling applications with operation temperature up to 90°C. A 140°C, 180°C melting point solder is recommended for the assem bling process.
Type “26” -
The elements with this coating are used to assemble the modules for applications with operation tem perature up to 110°C. The coating is applied by the magnetron for better uniformity and repeatability by orientation of metallization fl ow and applied metal layer thickness control. The antidiffusion Molybdenum sublayer protects the thermoelectric material from degradation of its electro-physical parameters. The preliminary etching of the working surface together with magnetron coating provides better density of metallization layer that also ensures repeatability of the coating adhesive strength. A 140°C, 180°C, 219°C, 232°C melting point solder is recommended for the assembling process.
Type “5B” -
The elements with this coating are used to assemble the modules for applications with operation tem perature up to 120°C and long-term “ON/OFF” operational mode. A 140°C, 180°C, 219°C, 232°C melting point solder is recommended for the assembling process.
Tin-Bismuth, Sn-Bi (Bi < 1 %): 7.0 ± 1.0 micron
Type “6B” -
The elements with this coating are used to assemble the modules for cooling applications with operation temperature up to 150°C. A 140°C, 180°C, 219°C, 232°C melting point solders are recommended for the assembling process.
1 950 Ohm-1cm-1 is standard. Other conductivity available at a premium. Ohm-1cm-1 at 25º C; standard tolerance: ± 5 %; reduced tolerance of ± 3 % is available as additional option. 2 Type 6M is standard. Other coatings available at a premium.
Methods
Material Growing Method
Thermoelectric Material Growing Method
Manufacturing Method
Thermoelectric Elements Manufacturing Method
Coating Application Method
Thermoelectric Elements Coating Application Method
