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All Categories > Thermal Interface Material (TIM) > Thermal Grease > Item # 505-61  
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Item # 505-61, Thermal Grease

Thermal Grease design with thin bond lines and excellent wetting properties are excellent for thermoelectric and other thermal applications. Silicone and nonsilicone formulations are available with thermal conductivity up to 4.5 W/mk.

Manufactured and quality tested under ISO 9001:2000 / TS 16949:2002 standards by EMS in the USA and China.

Typical Applications:

  • Thermal Assemblies/Thermoelectrics
  • Thermal interface between semiconductors case and heat sink
  • Computer CPU



Thermal Grease Nonsilicone Based, High Performance


86,000 cps (SP#51 @ 1.0 rpm)

Thermal Conductivity

4 W/mK

Thermal Resistance

0.078 ºC.in²/W