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All Categories > Thermal Interface Material (TIM) > Thermal Epoxy > Item # 505-58-1 A 601-08 B  
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Item # 505-58-1 A 601-08 B, Thermal Epoxy


Our epoxy offerings include thermal conductive 1-part and 2-part epoxies with thermal conductivity up to 3.3 W/mK. They are widely used on applications such as bonding fins to base plates of bonded fin and fold fin heat sinks, on liquid cold plates to bond tubes and in thermoelectric assemblies to bond thermoelectric modules and cold plates to objects being cooled/heated.

Our low density potting epoxy is used to form perimeter seals on thermoelectric modules to provide moisture protection, increased mechanical strength, and to minimize the impact on thermoelectric module cooling performance. The key features are low moisture absorption, strong bond, low thermal conductivity (0.19 W/mk) and viscosity formulated for speedy application.

EMS Epoxies are manufactured and quality tested under ISO 9001:2000 / TS 16949:2002 standards by EMS in the USA and China

Typical Applications:
  • Thermal Assemblies/Thermoelectrics
  • Heat Sink Assembly/Fin Bonding
  • Moisture/Environmental Protection





Specifications

Description
Epoxy, Encapsulating/Potting, Low Density, Moisture Resistant

Viscosity
40,000 cps (SP#7 @ 10 rpm)

Cure Schedule
45ºC (113ºF) 6 HR
25ºC (77ºF) 24 HR

Thermal Conductivity (ASTM D-5470)
0.19 W/mK

Gel Time
31 min (100 grams)