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Our low density potting epoxy is used to form perimeter seals on thermoelectric modules to provide moisture protection, increased mechanical strength, and to minimize the impact on thermoelectric module cooling performance. The key features are low moisture absorption, strong bond, low thermal conductivity (0.19 W/mk) and viscosity formulated for speedy application.
EMS Epoxies are manufactured and quality tested under ISO 9001:2000 / TS 16949:2002 standards by EMS in the USA and China