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Thermal Epoxy

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Our epoxy offerings include thermal conductive 1-part and 2-part epoxies with thermal conductivity up to 3.3 W/mK. They are widely used on applications such as bonding fins to base plates of bonded fin and fold fin heat sinks, on liquid cold plates to bond tubes and in thermoelectric assemblies to bond thermoelectric modules and cold plates to objects being cooled/heated.

Our low density potting epoxy is used to form perimeter seals on thermoelectric modules to provide moisture protection, increased mechanical strength, and to minimize the impact on thermoelectric module cooling performance. The key features are low moisture absorption, strong bond, low thermal conductivity (0.19 W/mk) and viscosity formulated for speedy application.

EMS Epoxies are manufactured and quality tested under ISO 9001:2000 / TS 16949:2002 standards by EMS in the USA and China

Typical Applications:
  • Thermal Assemblies/Thermoelectrics
  • Heat Sink Assembly/Fin Bonding
  • Moisture/Environmental Protection

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Item #



Thermal Conductivity (ASTM D-5470)

Gel Time

505-41 Epoxy Thermally Conductive 1-part 418,250 cps (SP#29 @ 10 rpm) 1.4 W/mK Shelf Life: 3 months @ 25ºC
498-11 A/B Epoxy Thermally Conductive 2-part, Aluminum Filled 50,400 cps (SP#7 @ 50 rpm) 1.2 W/mK 75 min (100 grams)
703-19 A/B Epoxy Thermally Conductive 2-part, Silver Filled Light Paste 3.3 W/mK 180 min
505-58-1 A 601-08 B Epoxy, Encapsulating/Potting, Low Density, Moisture Resistant 40,000 cps (SP#7 @ 10 rpm) 0.19 W/mK 31 min (100 grams)
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